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A*STAR AND SOITEC COMBINE ON PACKAGING DEVELOPMENT

The Agency for Science, Technology and Research’s (A*STAR) Institute of Microelectronics (IME) and Soitec are to develop and integrate a new layer transfer process within advanced wafer level multi-chip packaging techniques.

March 27th, 2019|News|

FAN-OUT PACKAGING GROWING AT 19.4%

The Fan-Out packaging market will grow at 19,4% CAGR 2019-24 to reach $3.8 billion in 2024, forecats Yole Developpment.

February 1st, 2019|News|

Loop’s launch brings reusable packaging to the world’s biggest brands

A new initiative by a small company has compelled more than two dozen of the world’s biggest brands to begin testing reusable packaging.

January 24th, 2019|News|

Smart Packaging – Answer to Sustainable Packaging Needs

In the last decade, many new innovations have been made in the field of flexible packaging. The demand for new, different and desirable characteristics has resulted in the creation of many new polymers to fulfill these needs.

IEBS - Smart packaging needs

In the […]

April 17th, 2017|Blog|