The Agency for Science, Technology and Research’s (A*STAR) Institute of Microelectronics (IME) and Soitec are to develop and integrate a new layer transfer process within advanced wafer level multi-chip packaging techniques.
The Fan-Out packaging market will grow at 19,4% CAGR 2019-24 to reach $3.8 billion in 2024, forecats Yole Developpment.
A new initiative by a small company has compelled more than two dozen of the world’s biggest brands to begin testing reusable packaging.
In the last decade, many new innovations have been made in the field of flexible packaging. The demand for new, different and desirable characteristics has resulted in the creation of many new polymers to fulfill these needs.
In the […]