Micron’s 1300 SATA SSD uses 96-layer TLC 3D NAND-based SSDs and delivers storage capacities up to 1TB (in M.2) and 2TB (in 2.5-inch).
Dialog Semiconductor has included an Arm Cortex-M33 application and algorithm processor in a Bluetooth 5.1 wireless microcontroller, to create a family called DA1469x.
Apple has filed for a new patent which showcases a touch enabled keyboard. The filed patent shows shows multi-layers on the keyboard.
University of Houston researchers have developed rubbery type materials for stretchable electronics.
Imec has made an on-chip solution for Raman spectroscopy – based on a newly patented concept – providing high optical throughput and high spectral resolution and is looking for partners to develop it commercially.
Mobile Semiconductor, the 13 year-old Seattle memory compiler vendor, has come up with a 55nm memory compiler for inexpensive applications like IoT.
Panasonic has launched a delamination-free semiconductor encapsulation material for semiconductor packages used in automotive and industrial applications.
Amphenol RF has introduced the small form factor AMC4 connector series.
Rockwell Automation has acquired Emulate3D whose products digitally simulate and emulate industrial automation systems.