Overview
AI and high-performance computing are reshaping data centers faster than ever. With power-per-server climbing and accelerator-heavy racks pushing densities to new extremes, air-based cooling is hitting its natural limits—driving persistent hotspots, wasted energy, and real constraints on future scaling. These pressures are accelerating the industry’s pivot toward liquid cooling, with direct-to-chip systems becoming standard in next-gen builds and immersion cooling steadily moving from pilot projects to broader adoption.
Our session, “From Hot Racks to Smart Cooling: A Modern Take on Dense Compute Cooling”, dives into this shift head-on. In one focused hour, we’ll break down why compute density is rising, the operational hurdles it creates, and how liquid cooling technologies are stepping up with the efficiency, stability, and scalability modern workloads demand. You’ll also get a forward look at the trends, innovations, and market opportunities shaping the future of data center infrastructure.
Key Points to Be Covered
- Cooling Technology Evolution: How cooling approaches have progressed from conventional air systems to advanced liquid cooling—and the factors driving this evolution.
- Innovation Landscape & Proof of Concept: A view of emerging innovations, R&D hotspots, pilot-stage solutions, whitespace, temporal and spatial technology evolution, and comparative insights across key performance indicators.
- Player Ecosystem Analysis: Mapping the ecosystem across R&D players, upstream and downstream collaborations, cross-industry partnerships, and academia–industry linkages.
- Market Dynamics: An exploration of the drivers, restraints, opportunities, and challenges defining the data center cooling landscape, along with key macro and micro triggers.
- Current Market Landscape: Understanding the structure of data center infrastructure—across tiers, categories, and geographies—and the parameters operators consider when selecting heat-rejection technologies.
- Market Expansion Outlook: Insights into strategic initiatives, partnerships, M&A, regional growth hotspots, and capital flows shaping liquid cooling and thermal management ecosystems.
- Business Models & Routes to Market: An overview of use cases, direct and indirect sales pathways, and the roles of system developers, integrators, and other key stakeholders.
- Future Roadmap & Expectations: A look at current challenges, mitigation strategies, future solutions, time-to-market expectations, and projected penetration timelines for liquid cooling technologies.
Who Should Attend?
Designed for data center operators, infrastructure teams, thermal engineers, solution developers, system integrators, technology strategists, and stakeholders preparing for high-density compute growth.
Speakers
Dirk Bolz
Managing Director - Business Development, Europe
Robin Willats
Managing Director - Consulting & Strategy, US
Rupesh Yelhekar
Senior Principal Consultant – Energy, Hi-tech, Mobility
Gaurav Malik
Principal Consultant – Energy, Hi-tech, Mobility
Saurabh Sharma
Principal Consultant - Hi-Tech Intellectual Property (IP)
Register now to decode the future of high-density cooling and build an infrastructure ready for the next wave of AI compute.
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