With the end of Moore’s law and the ever-increasing demand for compact chips, 3D Integrated Chips have come up as a potential solution to fulfill the requirement.
3D IC is a solution of high bandwidth, small form factor, and multi-function integration. It is the proper solution for meeting the requirements of electronic devices like better performance, high functionality, less power consumption, and a smaller footprint. Read this whitepaper to know about 3D integration technologies.
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