Micro-LED without encapsulation materials cannot meet the requirements to use; thus, a specific encapsulation is needed to provide mechanical protection, effective heat dissipation, electric connections, and high efficiency and quality light output. The encapsulation forms used on micro-LEDs are:
The demand for high-power micro-LED is growing exponentially, so it becomes more relevant to increase the demand for encapsulation materials. The micro-LEDs are used in devices to enhance their efficiency and provide high brightness, which comes with the challenges like heat dissipation, outside protection, and transparent surface. High-power micro-LEDs have an advantage in the automotive application and general lighting owing to efficient working for extended operating hours and low maintenance costs.
For micro-LEDs, organic encapsulant materials used are acrylic resin, epoxy resin, and phenolic resin; and some of the inorganic encapsulant materials used are silicon nitride layer, silicon oxynitride layer, and silicon oxide layer. Moreover, the encapsulants provide thermal transfer and light emission, which align with the addressable need of mid-and high-power micro-LEDs. Thus, the micro-LED encapsulation market is expected to grow substantially during the forecast period.
Our research team proposed a five-step approach and employed a comprehensive strategy covering secondary research, patent, and scientific research to conduct the study, followed by primary research, to help the client understand technologies and competition and uncover promising opportunity areas.
We provided the client with actionable recommendations on a few types of materials used for the encapsulation of micro-LEDs and their effects: