AstraZeneca announced that it has agreed to buy a US Food and Drug Administration (FDA) Priority Review Voucher (PRV) for a total cash consideration of $95m from a subsidiary of Swedish Orphan Biovitrum AB (publ) (Sobi). A PRV entitles the holder to FDA priority review of a single New Drug Application or Biologics License Application, which reduces the target review time and may potentially lead to an expedited approval.
Researchers have developed a new tool — dubbed SATI — to edit the mouse genome, enabling the team to target a broad range of mutations and cell types. The new genome-editing technology could be expanded for use in a broad range of gene mutation conditions such as Huntington’s disease and the rare premature aging syndrome, progeria.
The CRISPR genome-editing system is best-known for its potential to correct disease-causing mutations and add new genes into living cells. Now, a team from MIT and Harvard University has deployed CRISPR for a completely different purpose: creating novel materials, such as gels, that can change their properties when they encounter specific DNA sequences.
Solar panels have been a great benefit to the world’s interest in deriving electricity from alternative energy sources. However, one drawback to the technology is that the panels and cells themselves are created from toxic and non-environmentally friendly materials.
A wafer-level electronic interconnect solutions provider to the semiconductor industry, today announced that Industry researchers Yole and TechInsights have independently confirmed that M-Series™ fan-out wafer-level packaging (FOWLP) technology created by Deca Technologies has been adopted by Qualcomm for power management integrated circuit (PMIC) devices in Samsung’s flagship S10 handset, along with the Xiaomi Mi 9 and LG G8 handsets.
Even more recently, it has been proposed to integrate emissive inorganic semiconductor-based micro LEDs into displays. More specifically, it has been proposed to transfer individual micro LEDs from carrier substrates to a display substrate utilizing an array of electrostatic transfer heads.