IEBS News Updates from Automobile Industry in July 2022 - Ingenious e-Brain

IEBS News Updates from Automobile Industry in July 2022

Skeleton joining with Siemens and invest €220 million to develop a supercapacitor facility in Germany

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Skeleton Technologies and Siemens are working together to develop, plan, and build a fully automated, digitalized manufacturing facility to make supercapacitors. This partnership seeks to ramp up manufacturing of next-generation supercapacitors and accomplish the digitalization of Skeleton’s whole value chain, from supercapacitor cell design through manufacture and services. This will promote efficient production of supercapacitors and FCEV vehicles may be tremendously benefitted from such collaborations.

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Ricardo and Pratt & Whitney Canada have signed a multi-year agreement to develop hybrid-electric aeronautical technologies

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The Ricardo aerospace engineering team will assist Pratt & Whitney in the development of cutting-edge hybrid-electric propulsion systems for next-generation aircraft as part of a multi-year agreement that the two companies have inked. The deal represents a significant investment in Ricardo’s aerospace capabilities and resource. This collaboration will promote decarbonization & competitiveness in aviation industry.

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Foxconn and NXP have collaborated to develop connected vehicles platforms for next-generation mobility

 

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NXP Semiconductors and Hon Hai Technology Group have signed a memorandum of understanding for collaboratively developing connected vehicle platforms. This partnership will primarily support Foxconn’s work on EV platforms by utilizing NXP’s system experience and extensive electrification portfolio for gateways and vehicle networking control, automated driving augmented by NXP’s radar solutions, etc. This will promote V2V and V2I features on upcoming vehicles.

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Vitesco Technologies and Renault Group collaborated to develop power electronics for electric and hybrid powertrains

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A strategic relationship between the Renault Group and Vitesco Technologies has been established for the co-development and manufacture of power electronics in a unit known as the “One Box” for electric and hybrid powertrains.

The objective is to create a central electrical device that houses the inverter, on-board charger, and DC-DC converter all in one housing. Renault Group and Vitesco Technology teams will define the products and assembly methods of this “One Box” by combining the most recent technologies. This will bring highest degree of competitiveness in terms of performance and cost and will promote adoption of integrated powertrains.

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Audi and Freiburg University of Mining and Technology are looking at bio-leaching and membrane mining for high-tech components

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Together with the Freiberg University of Mining and Technology, the Audi Environmental Foundation is investigating innovative approaches to mining high-tech materials. For contemporary technologies like fibre optics, photovoltaics, and semiconductors, these metals and so-called rare earths are essential.

The intent of this collaboration is to develop a membrane technology that will help in rare earth metal extraction. Rare earth materials have had a very high surge in recent times and technology like this will have to find the solutions.

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GM and Pilot Company will develop an EVgo eXtend-powered coast-to-coast quick charging network

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GM and Pilot Company (Pilot and Flying J) are working together on a national DC fast charging network that will be installed, run, and maintained by EVgo through its eXtend offering in order to hasten the adoption of EVs, improve access to charging, and make it easier for people and vehicles to travel long distances on electricity throughout the United States. Around 2000 station will be stall through this project. This will help in accelerating the adoption of EVs and will boost innovations in fast charging technologies.

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SEMI, Foxconn Technology, and UMC launched program to boost supply chain in Taiwan

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The SEMI Auto IC Master programme was jointly launched by SEMI Taiwan, Foxconn Technology, and UMC. It is intended to offer comprehensive automotive chip solutions through close collaboration with Taiwan’s automotive semiconductor supply chain. This Collaboration will help in overcoming the shortage to meet the growth and it intends to encourage technical discussions on the R&D required to support next-generation technologies between major automakers and Taiwan’s supplier chain.

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